The 35th IEEE International Conference on Microelectronics, (ICM 2023)

The IEEE International Conference on Microelectronics (ICM) has already been held numerous times in different countries across the Middle East, Southern Europe, and Asia for the past 34 years. The 35th edition of the conference will take place in Abu Dhabi-UAE. This edition of ICM will foster oral and poster sessions, industrial panel discussions, and tutorials given by experts on state-of-the-art topics. The regular technical program will run for three days. The tutorial sessions will be held on the first day of the conference.

Vist the Website

Conference Topics

  • CAD Tools and Design
  • Simulation (process, device, circuit, logic, timing, functional)
  • Layout (placement, routing, floor planning, symbolic, ERC, DRC)
  • Silicon optimization
  • Parallel embedded systems
  • Testing: Formal verification
  • CAD for FPGAs
  • High level synthesis tools
  • Design for testability.
  • Circuits and Systems
  • Analog and RF circuit design techniques
  • Digital signal and data processing
  • Wireless communication systems
  • Nonlinear circuits
  • System on Chip (SoCs)
  • VLSI for Signal and Image Processing
  • Integrated antenna and front-end co-design
  • Signal Processing in Communications
  • Micro/Nanoelectronics
  • Device characterization and modelling
  • Device physics and novel structures
  • Process technology, CMOS, BJT,
  • BiCMOS, GaAs
  • Reliability and failure analysis
  • Optoelectronics
  • MEMS Devices
  • Packaging and surface mount technology


Dr. Arif Sultan Al Hammadi, Khalifa University Executive Vice President

Prof. Mohamad Sawan, Westlake University, China

Prof. Mohamed Elmasry, University of Waterloo, Canada

Dr. Hani Saleh, Khalifa University, UAE

Prof. Mahmoud Al-Qutayri, Khalifa University, UAE

Dr. Ghada Alsuhli, Khalifa University, UAE

Prof. Falah Awwad, UAE University, UAE

Prof. Baker Mohammad, Khalifa University, UAE

Prof. Abdallah Kassem, IEEE CAS, Lebanon

Prof. Ahmed Madian, IEEE CAS, Egypt

Prof. Najah Abu Ali, UAE University, UAE

Dr. Mohammad Hayajneh, UAE University, UAE

Dr. Yousef Al Hammadi, UAE University, UAE

Dr. Micheline Bejjani, American University in Dubai, UAE

Dr. Vinod Pangracious, American University in Dubai, UAE

Prof. Mahmoud Al Ahmad, UAE University, UAE

Dr. Amine El Moutaouakil, UAE University, UAE

Dr. Adel Najar, UAE University, UAE

Dr. Asma Mustafa, UAE University, UAE

Dr. Mahmoud Meribout, Khalifa University, UAE

Dr. Mohammed Tolba, Khalifa University, UAE

Dr. Muhammad Umair Khan, Khalifa University, UAE

Prof. Ibrahim Elfadel, Khalifa University, UAE

Dr. Mohamed Tabaa, L’Ecole Marocaine des Sciences de l’Ingénieur (EMSI), Morocco

Muhammad Umair Khan, KU, UAE

Prof. Thanos Stouraitis, Khalifa University, UAE

Prof. Said Hamdioui, Delft University of Technology (TU Delft), Netherlands

Mahmoud Al Qutayri, KU, UAE

Prof. Mohammed Ismail Elnaggar, Wayne State University, USA

Prof. Yehea Ismail, American University in Cairo, Zewail City, Egypt

Mahmoud Al Ahmad, KU, UAE

Prof. Said Al-Sarawi, University of Adelaide, Australia

Dr. Mohamed Atef, UAE University, UAE

Dr. Mihai Sanduleanu, Khalifa University, UAE

Dr. Khaldoon Mhaidat, Princess Sumaya University for Technology, Jordan

Dr. Ernesto Damiani, Khalifa University, UAE

Dr. Moh'd Rezeq, Khalifa University, UAE

Dr. Abdulhadi Shoufan, Khalifa University, UAE

Dr. Nawaf I. Almoosa, Khalifa University, UAE

Prof. Abbas Dandache, University of Lorraine, France

Prof. Adnan Harb, Lebanese International University, Lebanon

Prof. Hussam Amrouch, UStuttgart, Germany

Dr. Abdoul Rjoub, Jordan University of Science and Technology, Jordan

Prof. Khaled Salama, KAUST, KSA

Prof. Mohamed Masmoudi, National Engineering School of Sfax (ENIS), Tunisia

Prof. Amine Bermak, Hamad Bin Khalifa University, Qatar

Prof. Ahmed Bouridane, University of Sharjah, UAE

Raafat Lababidi, ENSTA, France

Sponsorship Opportunities & Packages

Benefits Bronze Silver Gold Platinum
Booth size (shell scheme) 9 sqm 9 sqm 12 sqm 18 sqm
Recognition during the opening ceremony
Logo, profile and hyperlink on the conference website
Logo on all conference collaterals and onsite branding
Acknowledgement on KU social media pages
Industry panel session presentation (10 minutes)
Page advertisement in the Conference op booklet Half Page 1 Page 1 Page 2 Pages
Bag inserts
Complimentary registrations 1 3 5 7
Complimentary exhibitor registrations 3 4 7 10
Rate $5,000 $7,000 $10,000 $15,000

Booth items

  • The following items will be included in the booth
  • One exhibition table and two chairs
  • Back wall
  • Company name on fascia
  • 2x 13 AMP Power Socket
  • Waste Bin

Additional Opportunities

  • Bag Sponsor: company logo will appear on the conference satchels - $ 3,000
  • Lanyards Sponsor: company logo will appear on conference op lanyards - $ 3,000
  • Conference op Gala Dinner Sponsor: company logo will appear on at the dinner venue - $ 5,000 (Sold)

Important dates

  • Submission of Special Sessions Proposals: Sept. 30, 2023
  • Submission of Tutorials Proposals: Sept. 30, 2023
  • Submission of Regular / Student Papers: Sept. 30, 2023
  • Notification of Tutorials Proposals Acceptance: Oct. 20, 2023
  • Notification of Special Sessions Proposals Acceptance: Oct. 20, 2023
  • Notification of Paper Acceptance: Oct. 20, 2023
  • Camera Ready Submission: Nov. 12, 2023

For more details, contact

Eyad Zerba

Senior Specialist, Public Relations & Marketing

P O Box 127788, Abu Dhabi, UAE

Khalifa University of Science and Technology

Phone : +971 2 312 5413

Email :